Packaging of High Power Semiconductor Lasers

Name: Packaging of High Power Semiconductor Lasers
Brand: Springer-Verlag New York Inc.
SKU: 2320124
Author: Xingsheng Liu

Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu

Springer-Verlag New York Inc.

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This book introduces high power semiconductor laser packaging design.The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

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